VLSI Design & Architecture
A deep-dive visualization into the CMOS fabrication process, from system-level specs to atomic-level silicon layers.
Full Design Flow
System Specifications
Transistor Geometry (FinFET/CMOS)
Process: 7nm/5nm
P-TYPE SUBSTRATE (Bulk Silicon)
STI
STI
SoC Floorplan & Macro Placement
Die Size: 120mm²
ARM CORTEX
A78 CORE
A78 CORE
L3 SHARED CACHE
MALI GPU
AUDIO DSP
Neural Engine (AI)
MODEM
I/O PAD RING
DDR5 MEMORY CONTROLLER
Macro-level placement of IP blocks and standard cells on the silicon die.
Technology Context
Modern VLSI uses FinFET or Gate-All-Around (GAA) structures at sub-10nm nodes. The Gate Oxide is now a High-K Dielectric to prevent tunneling, while Copper Interconnects use Low-K materials to reduce RC delay and cross-talk.
hardware_abstraction.sv
SystemVerilog
// RTL Representation of Digital Logic
always_ff @(posedge clk or negedge rst_n) begin
if (!rst_n)
out_reg <= '0;
else
out_reg <= (in_a & in_b) | in_c;
end