Computer Hardware Design & Assembly
Professional reference for PCB design, components, assembly, testing & troubleshooting
PCB Layout & Design Fundamentals
Design Layers
- Top Layer – Primary components & signals
- Ground Plane – EMI shielding & return paths
- Power Plane – Voltage distribution
- Bottom Layer – Secondary routing & SMD
⚠ Critical Design Rules:
Trace width ≥0.15mm for 1A • Via size ≥0.3mm • Clearance ≥0.1mm • Separate digital/analog ground
Trace width ≥0.15mm for 1A • Via size ≥0.3mm • Clearance ≥0.1mm • Separate digital/analog ground
Component Identification & Specs
⚡
Passive Components
Resistors, Capacitors, Inductors
Tolerance
±1% to ±5%
Package
0603-1206
🔌
Active Components
Transistors, ICs, Diodes
Frequency
MHz to GHz
Power
mW range
🖥
Connectors
Power, Signal, Data
Standards
USB, SATA, PCIe
Rating
5A @ 5V+
Assembly Process & Workflow
REFLOW PROFILE
Preheat: 160-180°C / 60-90s
Soak: 180-200°C / 60-120s
Peak: 240-260°C / 10-30s
Cool: 6°C/sec to room
QUALITY CHECKS
✓ Visual Inspection
✓ AOI Automation
✓ X-Ray Scan
✓ Functional Test
Troubleshooting Guide
Cold Solder Joint
Dull, grainy. Cause: Low temp. Solution: Reflow or hand-solder
Dull, grainy. Cause: Low temp. Solution: Reflow or hand-solder
Solder Bridge
Unwanted connection. Solution: Solder wick or desoldering
Unwanted connection. Solution: Solder wick or desoldering
Tombstoning
Component on one end. Solution: Reflow adjustment
Component on one end. Solution: Reflow adjustment
No Power
Check: Voltage, caps, regulator, fuse with multimeter
Check: Voltage, caps, regulator, fuse with multimeter
Latest Technology
🔬
AI Accelerators
Neural processors for ML
Performance
100+ TFLOPS
Process
5nm
⚡
Power Delivery
Advanced VRM
Phases
16+
Efficiency
97%+
🌡
Thermal
Liquid cooling
Dissipation
500W+
Efficiency
TDP -10°C
Top Brands
SEMICONDUCTORS
IntelAMDNVIDIAQualcommARMTSMCSamsung
MANUFACTURING
FoxconnFlexSanminaWistronCompal
COMPONENTS
MurataTDKYageoKemetVishay
Implementation Examples
Signal Integrity
- Matched impedance 50Ω
- Differential spacing ≤ 3x
- Ground under traces
- Via stitching 10mm
- Length match ±10mm
Power Integrity
- Bulk caps near VDD
- 0.1µF per IC pin
- 100nF decoupling
- Star-point grounding
- Separate planes
Thermal
- Thermal vias 0.5mm
- Copper ≥ 1cm²
- Mask removed
- Heatsink paste
- PCB 1.6mm min
EMI Mitigation
- Ferrite beads
- EMI LC filter
- Shielded zones
- Via stitching
- Twisted pairs